- Failure Analysis (FA) can be further divided into two major areas of support, Physical FA (PFA) and Electrical FA (EFA).
- ISO 9001:2000 and IECQ certified, our lab contains all the critical support tools to achieve success.
- SPIROX EVSD offers both PFA and EFA tooling Services and engineering support services to dynamically meet changing customer support requirements. Our in-house experts can support all tooling services for new product releases as well as continuous improvement and debug support for devices already in production.
PFA Lab
SPIROX EVSD supports all levels of PFA, from fundamental to frontier technologies.
| X-Ray:
|
|
| De-encapsulation |
| De-Layering/ RIE: |
Reactive Ion Etching. Wet and Dry etching. |
| Polish: |
Front Side/Back Side Polish |
| SEM: |
with EDS (Energy Dispersive X-ray Spectroscopy, EDX) for material analysis
|
| SAT: |
Scanning Acoustic Topography |
| Laser: |
Cutting/marking |
| OM: |
Optical Microscopy. High Res imaging
|
| TEM: |
Transmission Electron Microscope |
| De-processing/Reverse Engineering/Chip Size Measurement/Layer by Layer imaging
|
| EFA Lab |
|
| Probe Station: |
Active (Pico) Probing and Passive Probing. Discrete and system level.
|
| COB: |
Chip on Board (Custom Mounting of a die onto a special test board for debug)
|
| Static EMMI: |
Emission Microscope |
| SLS: |
OBIRCH |
| DEMMI: |
Dynamic EMMI |
| DLS: |
Dynamic Laser Scan |
| CAFM: |
Conductive Atomic Force Measurement |
| VC: |
Voltage Contrast |
| TRE: |
Time Resolved Emissions.Transistor level timing analysis |
| E-Beam: |
Internal Circuit Probing
|
| ATE: |
Automatic Test Equipment.Testing support |
| HP4155
|
|
| T-2500SE Thermal Head
|
 |
