Logic / Memory / Flash
Accretech UF3000
Next-generation high-spec probing machine, Accretech UF3000, the world No.1 supplier presents. Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment.


  • OTS - the newest positioning technology (Optical Target Scope)
  • QPU - super high-rigid chucking (Quad-Pod Unit)
  • ACCT Load-port (8 inch to 12” no any change kit require)
  • TTG (Touch To Go)

Available: Taiwan, China





Accretech UF200A/SA/AL
Evolving and Proliferating Wafer Probing Machine, UF Series.
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.


  • 8-inch multipurpose machine
  • High-Accuracy, high-performance, high-throughput, high rigidity and excellent cost performance machine

Available: Taiwan, China





Accretech FP200A
Evolving and Proliferating Wafer Probing Machine, UF Series.
based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.


  • Compatibility / Flexibility for normal wafer, thin wafer, diced wafer, and package
  • Frame transfer ready for the thinner wafer

Available: Taiwan, China

 




Logic
Accretech UF190B
Evolving and Proliferating Wafer Probing Machine, UF Series.
Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system.


  • High-performance, high-throughput, and excellent cost performance machine
  • The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel

Available: Taiwan, China




 

  

Logic/Memory/Flash
Logic


Taiwan Contact:
Karen_Wu@spirox.com.tw
Tel. +886 3 573 8099 ext. 2905

China Contact:
Ivy_Xiao@spirox.com.tw
Tel. +86-21-6108-1858 ext.300

 

 

 

 

 
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