Wafer Dicing
Accretech A-WD-300TX
The A-WD-300TX inherits the opposing-type spindle system developed by Accretech, incorporates a newly developed 80,000 rpm high-speed spindle, and features an X axis drive with a high movement speed of 1,000 mm per second. This has boosted productivity 1.3 times compared to the previous model. A-WD-300TX
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- Triple air acceleration cleaning heads have reduced cleaning time by approximately 1/2 (industry first).
- Standard provision of water cleaning unit reduces contamination during dicing process (industry first).
- Wafer protection system incorporated on transport arm prevents wafer from being dropped in the unlikely event air supply is interrupted (industry first)
Available: Taiwan, China |
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Mahohdicing Machine
The world's first dicing machine to cut silicon wafers utilizing a non-contact method without creating any damage to the wafer surface. This is the first laser dicer that focuses the laser to the inside section of the Si wafer. This selectively forms a modifying layer by irradiating the laser to the inside section of the Si wafer which causes the modifying layer to grow vertically creating die separation with no chipping.
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- Dices even thin, fragile, and easy-to-crack monocrystalline silicon wafers without causing physical stress.
- Throughput is improved dramatically due to the highspeed dicing a few times faster than the conventional machine.
- Complete dry process that requires no wash-up.
- Comparison of chip surfaces. (Click on image to view)
Available: Taiwan, China |
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Accretech A-WD-200T
A new face-to-face, twin-spindle arrangement. Air bearings, ceramic guides and a linear motor on the X-axis are used to achieve a completely contact-free drive mechanism which enhances dicing quality by minimizing vibration.
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- The linear motor is used at the X-axis driving unit, which attains less vibration and higher quality in process.
- The color LCD monitor and the touch panel for the easy operation.
- The X-axis is designed as maintenance-free, complete non-contact driving system.
Available: Taiwan, China |
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Accretech A-WD-250S
High process through user-friendly operations.
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- Production data management/ automatic machine condition data logging.
- The world's smallest fully-automatic wafer dicing machine.
- High accuracy, and high speed.
- Multi-function design and future system expandability.
Available: Taiwan, China |
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Accretech A-WD-110A
High process quality through user-friendly operations.
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- Incorporates image processing-type alignment function.
Available: Taiwan, China |
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Accretech A-WD-100A
High process quality through user-friendly operations.
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- Compact machine capable of dicing size up to 240 mm dia or 240x180 mm.
Available: Taiwan, China |
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Accretech A-WD-10B
This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor.
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- The Z-axis drive unit encoder system stepping motor guarantees high accuracy and reliability, and the X- and Y- axis slide section has a high accuracy, high rigidity linear guide.
- Simultaneous 2-axis control of X- and Y-axis and high throughput, with a max. speed of X-axis: 450mm/s, Y-axis: 80mm/s and Z- axis: 40 mm/s.
Available: Taiwan, China |
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Wafer Grinding and Polishing
Accretech PG 300 / PG 200
The product of a unique Accretech innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device.
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- Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine.
- All the processes are completed without moving the wafer on the same chuck table.
- The smallest footprint in the world.
- Environmental - friendly - subsurface damage reduction without chemicals.
- System Configuration. (Click on image to view)
Available: Taiwan, China |
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Accretech PG 300RM / PG 200RM
Accretech also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200.
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- Fully automatic intelligent wafer grinding and polishing equipment
- Subsurface damage depth reduction system with minimum chemical waste to drain
- Has successfully adopted the feature of both the front and back side wafer cleaning
- Compliance with FOUP, SMIF, SECS interface and GEM standard
- System Configuration
Click here to view
Available: Taiwan, China |
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Wafer Dicing
Wafer Grinding and Polishing
Taiwan Contact:
Karen_Wu@spirox.com.tw
Tel. +886 3 573 8099 ext. 3039
China Contact:
Crystal_Huang@spirox.com.tw
Tel. +86 21 6108-1858
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