Bright Field Wafer Inspection System
Accretech Win-Win 50

Accretech Win-Win 50 is based on state-of-the-art optics, a high speed image processing system and an extraordinarily precise wafer stage. The Win-Win 50 can handle wafers up to 300 mm.


  • Confocal optics provide higher resolution and less imaging influence from underlayer which can increase the sensitivity of surface layer 
  • Global mode provides higher sensitivity in memory area than traditional Die-to-Die mode 
  • RDC provides effective defect classification and is easy to operate due to rule-based algorithm 
  • High stage accuracy provides better defect review after inspection

Available: Taiwan, China  





Deep UV Wafer Inspection System
Accretech HA-3000
Accretech HA-3000 is a next generation DUV optical inspection system to inspect defects on pattern wafers for nano scale defect inspection down to 90nm, 65nm even 45nm devices.


  • 266nm laser illumination provides higher image contrast for ArF resist 
  • Hybride provides higher sensitivity in memory cell than traditional Die-to-Die mode 
  • SR optics provide higher image quality by polarization technology 
  • LIM algorithm can reduce noise due to color variation between different die and different oxide thickness 

Available: Taiwan, China






Deep UV Wafer Inspection System
Hitachi HA-3000

Hitachi HA-3000 is a next generation DUV optical inspection system to inspect defects on pattern wafers for nano scale defect inspection down to 90nm, 65nm even 45nm devices.


  • 266nm laser illumination provides higher image contrast for ArF resist 
  • Hybride provides higher sensitivity in memory cell than traditional Die-to-Die mode 
  • SR optics provide higher image quality by polarization technology 
  • LIM algorithm can reduce noise due to color variation between different die and different oxide thickness 

Available: Taiwan






Defect Review SEM System
Hitachi RS-4000

This SEM review station provides high speed and high accuracy SEM imaging of inspected defects for 90nm and even 65nm device manufacturing based on Hitachi's CD SEM experience.


  • 4 image capture at the same time (second electron, left and right oblique and voltage contrast) 
  • Defect classification by ADC 
  • Effective sampling by RI-1000 to reduce the time of all reviews

Available: Taiwan








Electron Beam Wafer Inspection System
Hitachi I-6300
This system integrates Hitachi's expertise of both E-beam and inspection to provide a stable and high sensitivity E-beam inspection system.


  • Provides both positive and negative voltage for best image comparison (traditional approaches use positive voltage)
  • No focus and calibration needed after stage rotation
  • High speed and high sensitivity inspection

Available: Taiwan







 

 

Bright Field Wafer Inspection System
Deep UV Wafer Inspection System
Defect Review SEM System
Electron Beam Wafer Inspection System


Taiwan Contact:
Sandy_Lai@spirox.com.tw
Tel. +886 3 573 8099 ext. 5019

China Contact:
Jessica_Chew@spirox.com.tw
Tel. +86 21 6108-1858