Application
- Removal of edge glue on TSV bonded wafer
- Removal of glue on TSV carrier wafer
- Full-cut process for TSV bonded wafer
- Glass edge end polishing and reinforcement(LCD / OLED)
Advantages
- No chipping/cracking on TSV device wafer
- Process simplify(Edge partial cutting, cleaning process)
- Control of removal rate by vision system(National project)
- Cost reduction compared to mechanical process
- Lower operation cost than mechanical process
Specification
- Foot print : 1,900*2,300*2,650(W*H*D, mm)
- Tact time : UPEH > 8 wafer
- Slurry material : Resin / SiC
- Removal area : Bevel top/ Side / Bottom
STI 是總部位於韓國的面板及半導體設備製造公司，其產品包含中央化學供酸系統、濕製程設備、OLED噴墨打印機、Foup清洗機和應用於半導體晶圓級封裝（Wafer Level Package）製程的真空迴焊設備, 濕式噴砂機, 以及面板級封裝（Panel Level Package）製程用濕製程設備等產品。STi成立20年來, 產品深獲客戶信賴, 客戶遍及台灣、中國、 韓國、日本,東南亞以及其它歐美系客戶。
