Wet Blaster System

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Wet Blast

Wet Blast

Wet Blast


  • Removal of edge glue on TSV bonded wafer
  • Removal of glue on TSV carrier wafer
  • Full-cut process for TSV bonded wafer
  • Glass edge end polishing and reinforcement(LCD / OLED)


  • No chipping/cracking on TSV device wafer
  • Process simplify(Edge partial cutting, cleaning process)
  • Control of removal rate by vision system(National project)
  • Cost reduction compared to mechanical process
  • Lower operation cost than mechanical process


  • Foot print : 1,900*2,300*2,650(W*H*D, mm)
  • Tact time : UPEH > 8 wafer
  • Slurry material : Resin / SiC
  • Removal area : Bevel top/ Side / Bottom


STI 是總部位於韓國的面板及半導體設備製造公司,其產品包含中央化學供酸系統、濕製程設備、OLED噴墨打印機、Foup清洗機和應用於半導體晶圓級封裝(Wafer Level Package)製程的真空迴焊設備, 濕式噴砂機, 以及面板級封裝(Panel Level Package)製程用濕製程設備等產品。STi成立20年來, 產品深獲客戶信賴, 客戶遍及台灣、中國、 韓國、日本,東南亞以及其它歐美系客戶。