Overview
- Semi-automatic flip chip bonder.
- Able to meet needs ranging from R&D to small volume production.
- Capable of stacking application in various programs for handling 3D packaging.
- Can be used for a variety of bonding processes and devices, such as ultrasonic, flux, NCP, NCF, TSV, and Cu pillars.
Features
- Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.
- The system is exchangeable among ultrasonic bonding processes, thermo-compression processes and solder processes, by a simple change-over. (Head change-over time: about 15 minutes)
It is possible to set a variety of temperature and pressure profiles, with the unique ceramic heater and pressure control method.
- Able to achieve the most appropriate gap with its unique head gap control function.
- Can be used for low pressure to high pressure regions by changing over the head.
Optional functions
Ultrasonic head; ultra-low pressure head; ceramic heat stage; face up bonding; dispenser; flux; bonding inspection unit; upper communication, etc.
東麗工程株式會社（Toray Engineering Corporation）是總部位於日本的綜合性工程及自動化生產設備製造公司，其業務包括生產和銷售用於平板顯示器及半導體生產的自動化生產檢測設備及各種製造業使用的檢測與監控儀器等。Toray 旗下INSPECTRA系列AOI在提供超高精度的晶圓表面缺陷全自動檢測的同時， 具有速度快，穩定度高的特點。此外，TORAY INSPECTRA AOI對Bumping, Sawn Wafer 等製程提供有效並獨特的檢測方案。Toray 還提供業內高精度的TCB/FC設備，用於chip to wafer/ substrate的 高精度die bonding solution。 同時，Toray可以提供客戶不同應用的設備，FC/TCB bonder有不同精度速率和設備來達到客戶不同的需求。
聯絡請洽：http://www.spirox.com.tw/contact
