Flip Chip Bonders

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  • These are flip chip bonders used for the application of semiconductor packages.
  • We can meet a wide range of needs, from R&D to mass production.
  • Our lineup has a variety of bonders for TSV 3D mounting, FOWLP, optical devices, and other purposes.

東麗工程株式會社(Toray Engineering Corporation)是總部位於日本的綜合性工程及自動化生產設備製造公司,其業務包括生產和銷售用於平板顯示器及半導體生產的自動化生產檢測設備及各種製造業使用的檢測與監控儀器等。