實現壓倒性高速度、高精度檢測，同樣適用於前道制程。
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Overwhelming high-speed inspection performance |
Inspection speed is 1.5 times faster than SR Series in high-resolution inspection. |
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Various lineup of optical systems are available |
BF/DF/DIC/Special Optics |
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Inspection tools |
Various kind of data input/output, Inspection result analysis system, Recipe sharing |
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Correspond to Special Wafer |
Thin wafer/Warped wafer, Panel inspection |
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Applicable wafer size |
(Size) 2 – 12 inch, (Type) Si, Compound wafer, Glass etc. |
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Target defect size |
＞0.5 um |
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Throughput |
＞200 WPH |
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Power device |
Front and backside inspection, Carrying control system of special wafer, Special optics etc. |
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CMOS image sensor |
BF/DF/DIC, PAD inspection etc. |
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Analog device |
BF/DF/DIC, High resolution inspection |
The corporate philosophy of the Toray Group is contributing to society through the creation of new values.
TASMIT, a member of Toray Engineering Group, executes this corporate philosophy with the aim of becoming a company that is highly valued by all of its stakeholders including customers, shareholders and employees.
To do this, TASMIT will contribute to solving social issues through its business and implement the idea of Creating Shared Value (CSV), which combines social values with corporate values.
TASMIT promises to provide effective solutions for the semiconductor device manufacturing with our two core technologies: optical wafer inspection "Inspectra" and electron wafer pattern inspection "NGR".
