Wafer Vacuum Laminator

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Wafer Vacuum Laminator

Wafer Vacuum Laminator

【Features】

  • Heat / Vacuum & Pressure lamination
  • High aspect ratio via filling 
  • 8” / 12”  are available
  • Auto cutting system inside
  • Void Free 
  • Uniformity > 98%

【Application】

  • Flip Chip, FOWLP, 3DIC…
  • Suitable for uneven surface topography
  • PR/PI film
  • BG/DAF or NCF
  • Mold

ELT was founded in 2015, focusing on bubble eliminate process and lamination technology.
The customer base covers semiconductor, photoelectric, display, automobile, traditional industries and other fields.
Adhere to high-quality performance to optimize process efficiency.
We are confident to be your best partner and provide the best solution for de-void and lamination.

Contact and consultationhttp://www.spirox.com.tw/en/contact