Probe Card

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Vertical Probe Card

Vertical Probe Card


It is used for high-efficiency (high density, high number of DUTs under test) in the wafer mass production stage.

【VC Features】

  • Advanced Bendable Probe (Cobra)
  • Pad and DUT for different objects to be tested
  • Arrangement.
  • Customized different Space Transformers
  • Meet different types of needs.

【VS Features】

  • Applied to WLCSP products.
  • With pogo pins, there is a high overload
  • current and frequency.
  • Installation and maintenance are simple.
  • Total customization.

【VM Features】

  • The MEMS probe structure has the preload assembly performance, which can maintain excellent stability and very low test scratch on the wafer test of Cu-pillar or Al Pad. In very narrow-pitch wafer testing, only very small scratch marks are produced, which effectively increases durability and reduces the frequency of needle changes.
  • Very suitable for high pin count (~30kpins/card), high current and high test requirements.

Shenzhen DGT Technology Co., Ltd.  is located in Shenzhen, the first city of China's reform and opening up, where there are many technology companies. Dougter Technology Co., Ltd. (DGT) focuses on the design, manufacture and maintenance of probe cards for testing such as semiconductor wafer (IC) testing, LCD screen testing, DRAM testing and other testing probe cards. Sales of needles and LED spot styli.