3S Silicon just announced the release of the latest version of IN-LINE VACUUM REFLOW OVEN for Power Device.
This latest version is equipped with features of low void rate, in-line production, automatic flux filtering, high throughput, superb price performance, low nitrogen consumption, high reliability and easy operation.
This vacuum reflow oven will be suitable for Power Device with high reliability such as automotive industry.
We have conducted many tests for packaged power devices, either for small die at 25mil, or for bigger die with size up to 210mil, all proved to be effective in reducing void rate to be lower than 2%.
3S is a total solution provider of die bonding in discrete power devices. 3S is established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.