Vacuum Pressure System

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Vacuum Pressure System

Vacuum Pressure System

The ELT vacuum pressure system breaks the bottleneck of traditional technology, adopts innovative invention patent technology, which uses the mode of vacuum + pressure interactive switching to eliminate the void problem. It can effectively remove the bubbles produced in die attached, potting, underfill, printing and OCA coating processes, as well as improve the quality and reliability of products. It is widely used in semiconductor, electronic assembly, 5G communication, new energy applications, automotive parts, aerospace modules, biotechnology testing and other major scientific and technological fields. It is safe to use for the furnace body is equipped with pressure vessel certification, overpressure and overtemperature protection device. To improve production efficiency, there are also extra matching items equipped, such as oxygen level control, volatile removal, and automatic door opening and closing design etc.

【Application】

  • Die attached
  • Potting
  • Printing
  • Underfill
  • Lamination

ELT was founded in 2015, focusing on bubble eliminate process and lamination technology.
The customer base covers semiconductor, photoelectric, display, automobile, traditional industries and other fields.
Adhere to high-quality performance to optimize process efficiency.
We are confident to be your best partner and provide the best solution for de-void and lamination.