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Assembly Process

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【Toray Engineering】Flip Chip Bonders

【Toray Engineering】Flip Chip Bonders

Capable of stacking application in various programs for handling 3D packaging.
Can be used for various work processes and devices, such as flux, NCP, NCF, Cu pillars, and TSV.

 

【Features】

  • A variety of temperature, pressure, and height profile settings are possible due to its own unique ceramic heater, and control method for pressure and position.
  • Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.
  • Able to achieve the most appropriate gap with its unique head gap control function.
  • Can be used for low pressure to high pressure regions by changing over the head.
 

【Specifications】

FC3000L2 (for Chip on Substrate)
Machine Type
Line configuration: loader, dispenser unit, packaging unit, chip loader, packaging unit, and unloader.
 
Fully automatic machine with increased production capability using two packaging units.
Substrate Size (mm)
125–250 mm long x 40–95 mm wide
(t=0.2–1.0 mm)
Chip size(mm)
Thermo-compression Bonding *1
3.0–20 mm long x 3.0–20 mm wide
(t=0.05–1.0 mm)
Ultra-low Pressure Bonding
3.0–20 mm long x 3.0–20 mm wide
(t=0.05–1.0 mm)
Chip Type
Wafer：1
Chip Orientation *2
Face up (Wafer 8",12")
Cycle Time *3
1.8 sec/chip
Alignment Accuracy (3 σ) *4
±2μm (X,Y)
Pressurization Force(N)
High-stiffness Head
9.8 – 490
Ultra-low pressure Head
0.098 – 9.8
Bonding Head Type
Ceramic heater head: temperature RT–450℃
Notes:
*1 Large-sized chip (max. 30.0 mm long x 30.0 mm wide) can be processed as an option.
*2 8" wafer and waffle tray can be processed with options.
*3 Cycle time does not include processing time (i.e. searching, bonding and vacuum release).
*4 Accuracy measurement is taken using Toray-standard substrates.

 

FC3000WL (for Chip on Wafer)
Machine Type
COW bonder with chip loader and wafer loader/unloader for mass production use
Substrate Size (mm)
8”, 12” t=0.725-1(㎜)
Chip Size(mm)
Thermo-compression Bonding *1
3–20 mm long x 3–20 mm wide
(t=0.05–1.0 mm)
Chip Type
1
Chip Loading Method
Wafer or tray pallet
Chip Orientation
Face up
Cycle Time *2
2.0 sec/chip
Alignment Accuracy (3 σ) *4
±2μm (X,Y)
Bonding Head Type
Ceramic heater head：temperature RT-450℃
Notes:
*1 Large-sized chip (max. 30.0 mm long x 30.0 mm wide) can be processed as an option.
*2 Cycle time does not include processing time (i.e. searching, bonding and vacuum release).
*3 Accuracy measurement is taken using Toray-standard substrates.

 

 

Toray Engineering Corporation is a comprehensive engineering and automatic production equipment manufacturing company headquartered in Japan. Its business includes the production and sales of automatic production testing equipment for flat panel display and semiconductor production, as well as testing and monitoring instruments used in various manufacturing industries. The INSPECTRA series AOI of Toray is characterized by high speed and high stability while providing ultra high precision automatic detection of wafer surface defects. In addition, TORAY INSPECTRA AOI provides an effective and unique detection scheme for Bumping, Sawn Wafer and other processes. Toray also provides high-precision TCB/FC equipment in the industry for the high-precision die bonding solution of chip to wave/abstract. At the same time, Toray can provide customers with equipment for different applications. FC/TCB bonders have different precision rates and equipment to meet different customer needs.