Probe Card

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Test Socket

Test Socket

【Application】

It is used for packaging and testing of semiconductor packaging and IT modules, including but not limited to storage IC/logic function test sockets, high-frequency test sockets, cameras, module LCD modules, and fingerprint identification module test sockets. (Applicable to various test sockets such as BGA/LGA/QFN/QFP/WLCSP/SOPetc).

【IC automatic test fixture】

  • Manual and automatic test fixtures suitable for various packaging forms.
  • Test spacing ≥ 0.30mm.
  • Automatic test fixtures that cooperate with various Handlers can be customized as needed.

【IC manual test fixture】

  • Manual and automatic test fixtures suitable for various packaging forms.
  • Test spacing ≥ 0.30mm.
  • Automatic test fixtures that cooperate with various Handlers can be customized as needed.
  • Suitable for CSP, BGA, mBGA, DIP, PGA, ZIP, PLCC, PQPP,
  • Testing of various ICs such as SQIP, SOIC, QFP, MLF, QFN, FBP, etc.

【RF IC test fixture】

  • Customize all kinds of RP RF IC fixtures according to your needs.
  • Frequency F≥10GH.
  • Resistance, R=50ohm, 75ohm.
  • Standing wave ratio≤1.3.

【IC aging test fixture】

  • Burn-in test fixtures for various types of packaged ICs can be customized as needed.
  • Temperature range -170℃~+200℃.
  • Test spacing ≥ 0.30mm.

Shenzhen DGT Technology Co., Ltd.  is located in Shenzhen, the first city of China's reform and opening up, where there are many technology companies. Dougter Technology Co., Ltd. (DGT) focuses on the design, manufacture and maintenance of probe cards for testing such as semiconductor wafer (IC) testing, LCD screen testing, DRAM testing and other testing probe cards. Sales of needles and LED spot styli.