The ERS MPDM700 System is ideal for the separation of the panel from its carrier related to the FOWLP technology. The debonding of the thermal release bonding agents is performed. The system offers high repeatability of results with respect to the quality of the debonded wafer.
Its special vacuum design and the large range of operating temperatures (up to +240°C) allow the debonding of very thin panels and warpage correction of up to 10mm. Like the previous generation of ERS tools, the MPDM700 features a contactless and smooth transport mechanism, which enables the transport of the panels from one temperature zone to the other while repairing warpage.
This tool is specially designed for research and development laboratories or pilot lines during the ramp-up of new technology.
Machine Description | Manual thermal debonding machine with warpage adjustment function |
Product size | 200mm, 300mm wafer Ø and panels up to 615mm x 615mm |
Product thickness | 300µm to 1000µm |
Carrier size | Up to 630mm x 630mm |
Carrier thickness | 0,5 to 5,0mm |
Warpage Handling Capability | Input: ±10mm, Output: <1mm |
Throughput (WPH) | *>15 wafers per hour |
Temperature Range | -10°C to 260°C (Station Dependent) |
Temperature Uniformity | Set Point ± 3°C |
Wafer Transfer System | TriTemp Slide and AirCushion System |
ESD Control | Strategic ionizer location with Auto-feedback system |
ERS electronic GmbH, based in Munich, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers across the semiconductor industry. ERS also developed eWLB series for warpage adjustment, and has kept making technology progress and improvements over a decade.
Contact and consultation:http://www.spirox.com.tw/en/contact