【Toray Engineering】FC3000W series

Overview

Flip chip bonder (for Chip on Wafer)
Capable of stacking application in various programs for handling 3D packaging.
Can be used in various work processes such as flux, NCP, NCF, and Cu pillars.

Features

• Able to handle 12-inch wafers.
• A variety of temperature, pressure, and height profile settings are possible due to its own unique ceramic heater, and control method for pressure and position.
• Able to achieve high accuracy (±2 μm) with its moving search function and highly stiff frame.
• Able to achieve the most appropriate gap with its unique head gap control function.
• Can be used for low pressure to high pressure regions by changing over the head.

Optional functions

Ultra-low pressure head; face up unit; dispenser; flux; bonding inspection unit; upper communication, etc.

Toray Engineering Corporation is a comprehensive engineering and automatic production equipment manufacturing company headquartered in Japan. Its business includes the production and sales of automatic production testing equipment for flat panel display and semiconductor production, as well as testing and monitoring instruments used in various manufacturing industries. The INSPECTRA series AOI of Toray is characterized by high speed and high stability while providing ultra high precision automatic detection of wafer surface defects. In addition, TORAY INSPECTRA AOI provides an effective and unique detection scheme for Bumping, Sawn Wafer and other processes. Toray also provides high-precision TCB/FC equipment in the industry for the high-precision die bonding solution of chip to wave/abstract. At the same time, Toray can provide customers with equipment for different applications. FC/TCB bonders have different precision rates and equipment to meet different customer needs.

Contact and consultation：http://www.spirox.com.tw/en/contact