Assembly Process

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【ELT】Wafer Vacuum Laminator

【ELT】Wafer Vacuum Laminator

Good filling ability, suitable for uneven surface!

The ELT Wafer Vacuum Laminator is different from traditional roller-type laminating machines. It innovatively attaches dry film under vacuum and develops a heating airbag laminating. Vacuum/pressure/temperature & time can be independently set according to material application, and secondary surface leveling and laminating can be expanded.

 

【Features】

  • High-aspect ratio: 1:20
  • Bump space filling and chip forming
  • Vacuum lamination with no void
  • Laminated surface morphology
  • Could be used for 8" and 12" inch wafer process
  • Suitable for a variety of dry film non-binding materials

 

【Application】

  • TSV Process
  • Temporary Wafer Bonding
  • RDL Process
  • Wafer Vacuum Mount
  • Underfill Process

 

 

ELT was founded in 2015, focusing on bubble eliminate process and lamination technology.The customer base covers semiconductor, photoelectric, display, automobile, traditional industries and other fields.Adhere to high-quality performance to optimize process efficiency.We are confident to be your best partner and provide the best solution for de-void and lamination.