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【Boffotto】Plasma Cleaning Solution

【Boffotto】Plasma Cleaning Solution

Designed for the cleaning and modification of microelectronic surfaces, Boffotto’s plasma cleaning equipment is capable of improving wire bonding and chip bonding, as well as filling deficiencies in flip chip packaging process. It is suitable for processing various electronic materials, including plastics, metals, and glass.

 

【Features】

  • Software monitoring of production processes
  • Product placement fixtures are flexible and versatile, adaptable to products of various shapes
  • Special stainless steel chamber and electrodes, with dust free generation during the production process
  • Extremely small footprint
  • Provides online plasma solutions suitable for highly automated production lines
  • 13.56MHz RF power source with automatic impedance matcher

 

【Applications】

  • Removing organic pollutants
  • Removing fluorine and other halogen pollution
  • Removing metals and metal oxides
  • Improving the adhesive force of spin-coated films
  • Cleaning metal bonding pads
  • Cleaning up contamination before wafer bumping

 

 

Boffotto (Hong Kong) Limited was established in 1993, is a R & D technology from the United States 30 years ion, engaged in system development and manufacture of ion etching cleaning company, and in expanding the use of plasma industry, to develop more plasma applications. We are a comprehensive collection of board professional and technical personnel and culture of Japan, Taiwan and Hong Kong company. In addition to the provision of plasma processing equipment, we also provide a full line of equipment for the production of FPC required more customers to provide free professional advice, such as plant layout, staff training, pre-production process counseling.