High-Volume Thermal Chuck

HOME / Products / ERS / High-Volume Thermal Chuck

AC3 Thermal Chuck

AC3 Thermal Chuck

AC3 modular patented air-only chuck system

Fully integrated hot/cold solutions for all major production and laboratory wafer probers

1. No liquids or Peltier elements
2. MTBF > 50,000 hours
3. Temperature ranges from -65 to +400 °C
4. Modular system, adaptable to individual testing requirements
5. High energy dissipation option with patented
    PowerSense® upgrade

ERS AC3 provides a full temperature range with air reliability and unmatched chiller compactness.

  • Air only – no liquids or Peltier elements
  • MTBF > 50,000 hours
  • Temperature ranges from -65 to +400 °C
  • Modular system, adaptable to individual testing requirements
  • Low-noise capability in the fA-range
  • High energy dissipation option with patented PowerSense® upgrade
  • Space-saving chiller dimensions
  • No separate purge air source required
  • Compatible with all major production probers and all major analytical probers
  • Full hardware and software integrations available
  • Service-friendly FRU (Field Replacement Units) component

Air-only cold test for 24-hour reliable operation

In use at renowned production floors and research laboratories world-wide, the patented AC3 system is famous for its wide temperature range, compact chiller, low power requirements and air-only reliability. Highest system uptimes, compact footprint in the clean room and reduced utilities costs translate to the lowest COO in the industry.

Unrivalled efficiency thanks to the patented ACP Technology

The core technology of the highly efficient AC3 is the patented ACP air management system. ACP extracts maximum effect from the chilled coolant air in a two-pass cooling operation. The expended super-dry, clean coolant air is then available as a cost-saving purge gas to prevent icing on the wafer and the surrounding area.

High performance for both laboratory and production environment

Close cooperation over the years with both the laboratory end-user and with the vendors of high-quality analytical wafer probers has produced the best performance in low-noise test. The demands of the wafer sort floor during high pin-count test are also met due to the high rigidity of the AC3 wafer chuck.


AC3 Thermal Chuck - TECHNICAL DATA

Available upper temperature limits +150°C up to +300°C, +400 °C option available
Available lower temperature limits +35, +20, -40, -55 °C
Coolant Air (user supplied)
Chuck Temperature Display Resolution 0.01°C 
Smallest Temperature Selection Step 0.1°C 
Temperature accuracy ±0.1 °C
Max. voltage between chuck top and GND  500 V DC (high voltage option up to 10 kV available)
Surface flatness and base parallelism -55 °C up to +300 °C < ±12µm (tighter range on request)
Temperature uniformity - 55 °C to +200 °C < ±0.5 °C 
> 200 °C < ±0.5 %
Electrical Isolation STD > 2,5 T Ohm at +25 °C
Temperature sensor Pt100 1/3DIN, 4-line wired
Chuck surface plating Nickel (gold or non-conductive available)
Interfaces RS232C, Ethernet, others on request
Control method Low noise DC/PID with Temperature Dynamic Control TDC
Heating rates for 300 mm system - 55 °C to +25°C:  10 min 
- 40 °C to +25°C:  8 min 
+25 °C to +150 °C: 15 min 
+25 °C to +200 °C:  20 min 
+25 °C to +300 °C:  30 min
Cooling Rates for 300 mm system +150 °C to +25 °C: 25 min 
+200 °C to +25 °C: 30 min 
+300 °C to +25 °C: 35 min
+25 °C to - 20 °C: 15 min
+25 °C to -40 °C: 25 min
+25 °C to -55 °C: 30 min


ERS electronic GmbH, based in Munich, has been producing innovative thermal test solutions for the semiconductor industry for 50 years. Today, thermal chuck systems developed by ERS in its product families; AC3, AirCool©, AirCool© Plus and PowerSense© are an integral component in all larger-sized wafer probers across the semiconductor industry. ERS also developed eWLB series for warpage adjustment, and has kept making technology progress and improvements over a decade.