Application
- Removal of edge glue on TSV bonded wafer
- Removal of glue on TSV carrier wafer
- Full-cut process for TSV bonded wafer
- Glass edge end polishing and reinforcement(LCD / OLED)
Advantages
- No chipping/cracking on TSV device wafer
- Process simplify(Edge partial cutting, cleaning process)
- Control of removal rate by vision system(National project)
- Cost reduction compared to mechanical process
- Lower operation cost than mechanical process
Specification
- Foot print : 1,900*2,300*2,650(W*H*D, mm)
- Tact time : UPEH > 8 wafer
- Slurry material : Resin / SiC
- Removal area : Bevel top/ Side / Bottom
STI 是总部位于韩国的面板及半导体设备制造公司，其产品包含中央化学供酸系统、湿制程设备、OLED喷墨打印机、Foup清洗机和应用于半导体晶圆级封装（Wafer Level Package）制程的真空回焊设备, 湿式喷砂机, 以及面板级封装（Panel Level Package）制程用湿制程设备等产品。STi成立20年来, 产品深获客户信赖, 客户遍及台湾、中国、 韩国、日本,东南亚以及其它欧美系客户。
