电性失效分析

HOME / 解决方案与服务 / 芯片制程质量解决方案 / 电性失效分析

【HAMAMATSU 】Thermal F1

【HAMAMATSU 】Thermal F1

Thermal F1

The "Thermal F1" is the next generation in thermal emission microscopy. Completely redesigned from the ground up by the same engineers responsible for the PHEMOS, the F1 features an automated microscope stage, best-in-class sensitivity, high frame rate lock-in thermography, and the ability to cover a wide range of devices from die-level to board-level fault isolation.

Features

High sensitivity
Custom designed low-noise InSb camera with thermal lock-in achieves world class sensitivity

Covering the ideal thermal emission range from 3.7 μm to 5.2 μm, the Stirling cooled thermal emission camera seamlessly integrates with a lock-in amplifier to reduce noise and pinpoint thermal emissions.

Wide field of view

Automated stitching function allows for board-level field of view (FOV)
Designed with ease-of-use in mind, the automated microscope stage movement combines with software image stitching function to cover an area much larger than is possible with a single objective lens.

Multi analysis target

Flexible selection of sample stage
A large area accommodating many probing stage form factors allows users to choose a stage with the best work flow and probing set-up for each labs' custom needs.

Applications

  • Metal shorts
  • Abnormal via resistance
  • Dielectric leakage or breakdown
  • Temperature distribution on the device

Specifications

Line voltage AC200 V to 240 V ±10 % (50 Hz/60 Hz)
Vacuum More than 80 kPa (Tube with outer diameter 6 mm) for prober
Compressed air 0.5 MPa to 0.7 MPa (Tube with outer diameter 6 mm)
Dimension and weight(Main unit) 960 mm×980 mm×1800 mm, Approx. 500 kg
Dimension and weight(Operation PC desk) 1000 mm×800 mm×700 mm, Approx. 60 kg

 


日本滨松光子学株式会社(HAMAMATSU)是全球光子技术、EFA领域的领导企业。自1953年成立以来,EFA失效分析产品销往全球半导体各大企业,拥有数量最多的半导体和面板行业客户。HAMAMATSU为客户提供EFA失效分析领域的缺陷定位解决方案,开发的微光显微镜是业界主流的高分辨率热点定位设备,且拥有多项专利产品。设备具备Thermal,EMMI,OBIRCH等分析功能方法。

联络请洽:http://www.spirox.com.tw/cn/contact