Reflow System

HOME / 产品信息 / STI / Reflow System

SRS30V Fluxless Reflow System

SRS30V Fluxless Reflow System

SRS30V Fluxless Reflow System

Applications

  • Fluxless/Flux(Lead free) reflow for solder bump ball, CU pillar & micro bump
  • Vacuum reflow system(Model : SRS30V))

Advantage

  • Void-free bump ball connection
  • Void-free bump ball performance
  • Vacuum reflow system by dry pump(~3mTorr)
  • Various temp. profile(Step & Slope type)
  • Outstanding O2 density control(〈1ppm) at every process : to improve process quality

Foot Print

  • Foot print : 2,350*2,520*2,800(W*H*D)
  • Temp. control : 250℃±1%(Max. 450℃)
    Real time monitoring of process wafer temp.
  • Process gas : Formic acid or no reactant gas
  • Process pressure : Low pressure(Model : SRS30V)
    Normal pressure(Model : SRS300).
  • EFEM(2 or 3 port) : SEMI Standards.

 


STI 是总部位于韩国的面板及半导体设备制造公司,其产品包含中央化学供酸系统、湿制程设备、OLED喷墨打印机、Foup清洗机和应用于半导体晶圆级封装(Wafer Level Package)制程的真空回焊设备, 湿式喷砂机, 以及面板级封装(Panel Level Package)制程用湿制程设备等产品。STi成立20年来, 产品深获客户信赖, 客户遍及台湾、中国、 韩国、日本,东南亚以及其它欧美系客户。