Laser Micro Trimming Equipment

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LMT-HR Series

LMT-HR Series

With our unique optical design and alignment technology, the LMT-HR Series offer best solution for the analogue memory semiconductors' fuse cutting.

Made-in-Japan parts are adopted for the major parts (such as laser light source, optical system, and stage etc.) to ensure stable supply.
The size request from 4~12 inches can be accommodated.
Our unique optical design and alignment technology enabled ultra-accurate trimming accuracy. The defective wires on the semiconductor wafer can be cut and the fuses within the IC chips can be trimmed to adjust the resistance.

Example process

Example of laser processing

东丽工程株式会社(Toray Engineering Corporation)是总部位于日本的综合性工程及自动化生产设备制造公司,其业务包括生产和销售用于平板显示器及半导体生产的自动化生产检测设备及各种制造业使用的检测与监控仪器等。Toray 旗下INSPECTRA系列AOI在提供超高精度的晶圆表面缺陷全自动检测的同时, 具有速度快,稳定度高的特点。此外,TORAY INSPECTRA AOI对Bumping, Sawn Wafer 等制程提供有效并独特的检测方案。Toray 还提供业内高精度的TCB/FC设备,用于chip to wafer/ substrate的 高精度die bonding solution。 同时,Toray可以提供客户不同应用的设备,FC/TCB bonder有不同精度速率和设备来达到客户不同的需求。