Inverted Microscope iPHEMOS Series

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The inverted emission microscope is a backside analysis system designed to identify failure locations by detecting the light and heat emitted from the defects in semiconductor devices.
The signal detection from backside facilitates the use of probing and probe card to the wafer surface, and the sample setting can be performed smoothly. The platform, possible to mount multiple detectors and lasers, enables the selection of the optimum detector for performing various analysis methods such as light emission and heat generation analysis, IR-OBIRCH analysis, and others; moreover, letting dynamic analysis perform efficiently by tester connection.

Support for measurement from a single chip to a wafer by mounting a 300 mm wafer prober. Multi-pin needle contact by probe card and sample observation on PC board are available. Dynamic analysis with LSI tester drive is also possible by cable connection.

Example of connection to the LSI tester


  • Two ultra-high sensitivity cameras mountable for emission analysis and thermal analysis
  • Lasers for up to 3 wavelengths and a probe light source for EOP are mountable
  • Multi-platform capable of mounting multiple detectors
  • High sensitivity macro lens and up to 10 lenses suitable for each detector sensitivity wavelength


  • Includes laser scan system
  • Emission analysis with high-sensitivity near-infrared camera
  • Thermal analysis with high-sensitivity mid-infrared camera
  • IR-OBIRCH analysis
  • Dynamic analysis by laser irradiation
  • EO probing analysis
  • High-resolution and high-sensitivity analysis using NanoLens
  • Connects to CAD Navigation
  • Connects to LSI tester

Display functions
Superimposed display/contrast enhancement function

The iPHEMOS-MP superimposes the emission image on a high-resolution pattern image to localize defect points quickly. The contrast enhancement function makes an image clearer and more detailed.

Display function

  • Annotations: Comments, arrows, and other indicators can be displayed on an image at any location desired.
  • Scale display: The scale width can be displayed on the image using segments.
  • Grid display: Vertical and horizontal grid lines can be displayed on the image.
  • Thumbnail display: Images can be stored and recalled as thumbnails, and image information such as stage coordinates can be displayed.
  • Split screen display: Pattern images, emission images, superimposed images, and reference images can be displayed in a 4-window screen at once.


Line voltage AC 200 V (50 Hz/60 Hz)
Power consumption Approx. 1400 VA (Max. 3300 VA)
Vacuum Approx. 80 kPa or more
Compressed air 0.5 MPa to 0.7 MPa
Dimensions/Weights Main unit: 1740 mm (W)×1150 mm (D)×1770 mm (H), Approx. 1400 kg
Control rack: 880 mm (W)×700 mm (D)×1542 mm (H), Approx. 255 kg
Optional desk: 1000 mm (W)×800 mm (D)×700 mm (H), Approx. 60 kg

*Weight of iPHEMOS-MP main unit includes a prober or equivalent item.